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Sep 20, 2026
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EECT 103 - Soldering
PROGRAM: Electronics and Computer Technology
CREDIT HOURS MIN: 1
LAB HOURS MIN: 2
DATE OF LAST REVISION: Fall, 2020
Students practice and develop skills soldering and desoldering through-hole and surface mount components. Students will use and maintain commercial grade solder/desolder stations. Also students will be introduced to basic fabrication techniques.
MAJOR COURSE LEARNING OBJECTIVES: Upon successful completion of this course, the student will be expected to:
- Use basic hand tools when soldering/desoldering electrical and electronic components.
- Etch circuit boards.
- Safely remove through-hole electrical and electronic components.
- Safely install through-hole electrical and electronic components.
- Safely remove surface mount electrical and electronic components.
- Safely install surface mount electrical and electronic components.
- Populate electrical and electronic components onto printed circuit boards.
- Prepare circuit boards for installation and removal of electrical and electronics components.
- Tin soldering irons and solder extractors prior to use.
- Inspect solder connections for defects.
- Correct solder connection defects.
- Properly maintain soldering/desoldering equipment.
- Prepare circuit boards and components for soldering/desoldering.
- Properly splice and solder wire connections.
- Properly apply shrink tubing and/or other insulation to electrical connections.
- Properly solder and desolder electrical components to terminal strips.
- Properly remove insulation from wire.
- Solder and desolder wire and cables onto various electrical connectors.
- Describe Ball Grid Array (BGA) technology.
COURSE CONTENT: Topical areas of study include -
- Soldering
- Desoldering
- Through-hole
- Surface mount
- Etching
- Circuit construction
- Fabrication
- Insulation removal
- Tinning
- Printed circuit boards
- Connectors
Course Addendum - Syllabus (Click to expand)
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