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Aug 06, 2026
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EECT 154 - Microelectronics Packaging
PROGRAM: Electronics and Computer Technology
CREDIT HOURS MIN: 3
LECTURE HOURS MIN: 2
LAB HOURS MIN: 2
TOTAL CONTACT HOURS MIN: 64
DATE OF LAST REVISION: Fall 2025
The course will introduce the materials, processes, and technologies used in back-end processes during semiconductor manufacturing. Students will learn how devices are packaged, interconnected, and protected for use in electronic systems. Topics will include packaging techniques used in the industry, such as die attach, wire bonding, flip-chip, surface mount assembly, encapsulation, inspection, and reliability testing. Laboratory activities will include hands-on assembly, inspection, and environmental testing of packaged devices and circuit boards.
MAJOR COURSE LEARNING OBJECTIVES:
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Describe the purpose and sequence of back-end manufacturing steps in semiconductor production.
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Analyze materials and methods used in die attach, wire bonding, and encapsulation.
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Perform basic chip-to-package, package-to-board, and board to peripheral connections.
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Explain how package design affects electrical, thermal, and mechanical performance.
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Apply soldering and rework techniques for microelectronic assemblies.
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Operate inspection and testing tools used for quality control and reliability evaluation.
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Interpret common packaging standards and documentation.
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Demonstrate ESD control, cleanliness, and handling procedures for packaged devices.
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Inspect premade components for quality and functionality.
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Prepare technical reports documenting assembly processes, observations, and test results.
COURSE CONTENT: Topical areas of study include -
- Semiconductor back-end manufacturing
- Packaging techniques
- Die preparation, dicing, and die attach methods
- Wire bonding and advanced interconnect technologies
- Bond wire selection and characterization
- Encapsulation, molding, and sealing techniques
- Surface-mount assembly and reflow soldering
- Package inspection and failure analysis
- Reliability testing and environmental stress screening
- Semiconductor supply chain quality control
- Packaging process troubleshooting
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