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Aug 06, 2026
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EECT 151 - Introduction to Semiconductor Fabrication
PROGRAM: Electronics and Computer Technology
CREDIT HOURS MIN: 3 CREDIT HOURS MAX: 3
LECTURE HOURS MIN: 2
LAB HOURS MIN: 2
TOTAL CONTACT HOURS MIN: 64
DATE OF LAST REVISION: Fall 2025
This course will introduce the principles, tools, and processes used in semiconductor manufacturing. Students will learn the process steps used in front-end wafer fabrication to construct basic microelectronic devices. The course will include labs with fabrication and testing equipment and discussions about theory and practices associated with fabrication processes. Topics will include safe working practices, the use of cleanrooms, gowning procedures, fabrication device fundamentals, diagnostic processes, and process controls.
MAJOR COURSE LEARNING OBJECTIVES:
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Explain the fundamental steps in front-end semiconductor fabrication.
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Summarize the physical and electrical properties and crystal structures of semiconducting materials and their relevance to device behavior.
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Perform wafer cleaning and inspection, thin-film deposition, wet and dry etch, and photolithography processes.
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Evaluate process variation through troubleshooting and failure analysis methods.
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Relate fabrication processes to real-world microelectronics and semiconductor devices and applications.
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Demonstrate proper cleanroom laboratory safety, contamination control, and process documentation practices.
COURSE CONTENT: Topical areas of study include -
- Semiconductor materials and crystal structure
- Wafer preparation and cleaning
- Comparison of macro, micro, and nano scales
- Microelectronics and semiconductor devices
- Fabrication overview
- Cleanroom safety and operation
- Deposition processes
- Photolithography
- Etching processes
- Device inspection, testing, and yield analysis
- Process control and troubleshooting
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