2022-2023 Catalog [ARCHIVED CATALOG]
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MTTC 207 - Tooling Design II PREREQUISITES: Demonstrated competency through appropriate assessment or earning a grade of “C” or better in ENGL 0XX and MATH 0XX, and MTTC 102 - Turning Processes I , and MTTC 103 - Milling Processes I , and MTTC 105 - Abrasive Processes I
OR
Demonstrated competency through appropriate assessment or earning a grade of “C” or better in ENGL 0XX and MATH 0XX, and MTTC 110 - Turning and Milling Processes , and MTTC 105 - Abrasive Processes I . PROGRAM: Machine Tool Technology CREDIT HOURS MIN: 3 LECTURE HOURS MIN: 2 LAB HOURS MIN: 2 DATE OF LAST REVISION: Spring, 2019
Covers concepts of complex tooling design. Emphasizes forming, blanking, piercing and progressive type die design. Includes die applications, components, manufacture and assembly techniques.
MAJOR COURSE LEARNING OBJECTIVES: Upon successful completion of this course the student will be expected to:
- Interpret detail and assembly drawings of die configurations. (b)
- Identify specific types of dies. (b,f)
- Identify specific applications of dies. (b,f)
- Solve mathematical problems related to the design and manufacture of dies. (e)
- Apply engineering specifications to the design of a die. (b,e,i)
- Identify specific die components. (f)
- Explain the function of die components. (f)
- Apply specific tolerances to die components in a die assembly. (a,c,i)
- Manufacture a functioning die that meets or exceeds industry standards. (a,b,c,e,i)
Note: Letters following objectives correspond to ATMAE Outcomes.
COURSE CONTENT: Topical areas of study include -
- Bending dies
- Principles of blanking and piercing dies
- Die life
- Screw and dowel holes
- Punches
- Mounting punches in punch plates
- Pilots
- Die block constructions
- Nest gages
- Strippers and stock guides
- Pushers
- Shedders and knockouts
- Wipers
- Stock utilization and strip layout
- Die stops
- Die maintenance
- Die sets
GRADING POLICY
A |
90-100 |
B |
80-89 |
C |
70-79 |
D |
60-69 |
F |
0-59 |
Course Addendum - Syllabus (Click to expand)
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